Flexible integrated piezoelectric sensor

The flexible printed circuit is composed of a flexible substrate layer and a copper foil layer crimped by a binder, relying on the copper foil layer contained between the flexible substrate for signal transmission, and finally realizing the input/output of the signal at a unified signal interface. A single piezoelectric wafer is glued to the film with excellent properties of engineering capability, durability, and flexibility.

Flexible, anti-interference thermocouple piezoelectric sensors

It can be used as an actuator and a sensor with strong anti-interference, easy installation, and superior stability. The sensor is equipped with a thermocouple and temperature information collection can be achieved in different temperature environments.

Piezoelectric self-sensing composites

The integration of load bearing and structural sensing, which realizes the self-actuation and self-awareness of the structure with excellent load-bearing performance. Outstanding engineering property and applicability, by setting electrodes with different positions, different sizes and shapes, instead of traditional sensors, to complete the monitoring of the structures’ health statuses.

Alumina encapsulated lamellar piezoelectric sensor

The sensor is composed of an embedded PCB conversion board, impedance, and piezoelectric ceramic wafer. It is integrated with a thin-chip packaging process that tightly combines the upper and lower surface alumina silver-plated electrodes to the surrounding aluminum shell. Such a design improves the response sensitivity and portability. At the same time, it embeds a high-impedance resistor chip and leads the SMA interface through the embedded shielded wire, which achieves efficient noise reduction and anti-interference performance, with the noise level reduced by 10% compared to the conventional packaging process.